Thanks to electronic miniaturisation, devices of ever smaller size can be manufactured with the aim of being less invasive in procedural techniques and significantly reduce trauma caused by surgical interventions, diagnosis and other medical procedures.

In this field, the following consolidated technologies can be used:

  • Thick Film deposition.
  • Multi-layer and hybrid circuits.
  • Chip-and-wire: bonding of MEMS or die in silicon (wedge bonding and ball bonding).
  • Finishing and encapsulation with conformal coating, epoxy and silicone resins.
Examples of applications:
  • Miniature piezoresistive microsensor, for example for integration in catheter or probe.
  • Miniature pressure sensors for application on detectors and probes.